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Brand Name : | Dow Corning |
Model Number : | Dow Corning TC-5021 |
Price : | CN¥933.03/pieces 1-49 pieces |
Delivery Time : | 5-8days |
Payment Terms : | T/T,L/C,D/A,D/P,Western Union,MoneyGram |
Supply Ability : | 1000Piece |
Certification : | TDS,SDS,Rohs |
Product Basic Attributes
Dowsil TC-5021 is a non-curing, thermally conductive silicone paste
designed to provide efficient thermal management solutions for
electronic devices. It is engineered to offer high thermal
conductivity, low thermal resistance, and stable performance at
elevated temperatures, making it an ideal choice for applications
requiring reliable heat dissipation.
Product Overview
Dowsil TC-5021 is a high-performance thermal interface material
that ensures optimal heat transfer between electronic components
and heat sinks or chassis. Its grease-like consistency allows for
easy application and reworkability, while its high thermal
conductivity helps to improve the overall efficiency of electronic
devices by effectively managing heat. The product is formulated to
maintain its properties over a wide temperature range, ensuring
consistent performance in demanding environments.
Special Attributes
Dowsil TC-5021 stands out due to its exceptional thermal
conductivity and low thermal resistance, which are critical for
maintaining the performance and reliability of electronic devices.
It is designed to resist changes in consistency at high
temperatures, up to 177°C (350°F), ensuring a stable heat sink
seal. This feature helps to improve heat transfer from the device
to the heat sink or chassis, thereby enhancing the device's overall
efficiency. Additionally, the product is non-curing, which means it
does not harden over time, allowing for easy rework and
reapplication if necessary.
Application Scenarios
Dowsil TC-5021 is widely used in various electronic applications
where efficient heat dissipation is critical. It is commonly
applied as a thermal interface material for CPUs, GPUs, and other
high-power electronic components. The product is also suitable for
use in power modules, LED lighting, and other devices that require
effective thermal management. Its ease of application and
reworkability make it a preferred choice for both manufacturing and
repair processes.
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